| Model | WTS-L10 Series |
| Machine Type | Wafer to Tape Sorter (Linear System) |
| Throughout (by die size) |
0.3mm – 2mm = 10,000 UPH 2mm – 6mm = 9,000 UPH 6mm – 12.5mm = 8,000 UPH |
| Placement Accuracy |
+/- 25um at 3 sigma +/- 1 degree theta |
| Die Size | 0.3mm to 12.5mm |
| Wafer Input | Automated wafer loading 25 slots, for wafer up to Ø 300mm |
| Vision Inspection | Wafer Inspection and Die During Placement Inspection (DDP) – Bump size, shape, array – Edge chip – Ink dot – Place position X, Y, ØPre-Place & Post-Place Inspection – Edge chip – Laser mark – Pin 1 – Position in-pocket Tilted Die Inspection After Seal Inspection |
| Tape Width | 8mm to 24mm |
| Reel Dimension | Input : 22″ Output : 7″ & 13″ Cover Tape: 220mm (OD) |
| Network | Ethernet or SECS TCP/IP |
| Footprint | 1980mm x 1720mm x 2150mm |
| Facilities | Air : 6 to 7 bars Power: 220-240VAC, 1 PHASE 1.0KVA, 50-60Hz |
| Optional | Flip or Non-Flip Die JEDEC Tray Indexer Waffle Pack Indexer |