| Model | WTS-T Series |
| Machine Type | Wafer to Tape Sorter (Turret System) |
| Throughout (by die size) |
0.8mm – 2mm = 12,000 UPH 2mm – 6mm = 10,000 UPH 6mm – 12.0mm = 8,000 UPH |
| Placement Accuracy |
+/- 25um at 3 sigma +/- 1 degree theta |
| Die Size | 0.8mm to 12.0mm |
| Wafer Input | Automated wafer loading 25 slots, for wafer up to Ø 300mm |
| Vision Inspection | Wafer Inspection andVision Positioning Inspection – Bump size, shape, array – Edge chip – Ink dot – Place position X, Y, ØBottom Inspection / 2D – Edge chip – Laser mark – Pin 1 – Position in-pocketTilted Die Inspection – Die flat in pocket After Seal Inspection |
| Tape Width | 8mm to 24mm |
| Reel Dimension | Input : 22″ Output : 7″ & 13″ Cover Tape: 220mm (OD) |
| Network | Ethernet or SECS TCP/IP |
| Footprint | 1900mm x 1080mm x 2150mm |
| Facilities | Air : 6 to 7 bars Power: 220-240VAC, 1 PHASE 1.0KVA, 50-60Hz |
| Optional | Flip or Non-Flip Die Test or Non-Test Tube Loader Detaper to Tape |